A three-dimensional integrated circuit or 3D IC is a metal-oxide-semiconductor. Produced with stacking silicon dies or wafers, integrated circuits are interconnected vertically for improved performance. The improved performance helps with reducing power and decreasing footprint. In this integrated circuit, electronic components are integrated vertically and horizontally on a single chip forming multiple layers. Below, we will discuss some emerging trends in the 3D ICs markets:
Emerging Trends in the 3D ICs Markets
Here are three major sectors where 3D ICs is playing a tremendous role in the development of the markets:
1. Consumer Electronics
Companies such as Fabs and Foundries are using heterogeneous integration chip components to improve user experience and increase popularity in the consumer electronic market. Companies in the consumer electronic device market encounter various challenges to low power consumption and enhanced performance. They intend to reduce chip size to 5nm or below. To overcome the problems in lower technology node design, they have to shift from 2.5D to 3D ICs. Here are some benefits of using 3D ICs in consumer electronic markets:
· Low power design
· Enhanced bandwidth and memory capabilities.
· Enabled connected and smart devices
· High-speed data management
· Dynamic thermal management
2. Machine Learning (ML)
The scope of Artificial Intelligence is rapidly increasing in our daily life. For instance, voice assistant speakers such as Siri, Google Home, and Amazon’s Alexa to self-driving vehicles. When lower technology node design falls to 5nm or 3nm, variations might be a problem. However, implementing design techniques such as 3D ICs would be significantly beneficial. Integrating 3D ICs with machine learning techniques will develop accurate and fast simulation variation modes that will replace 2D ICs, which is a computationally expensive simulation. Here are some ways in which machine learning and 3D ICs can help the market:
· Predicting future manufacturing defects
· Improving chip optimization
· Anticipating load on a CPU and scaling down the voltage
· Reducing problems through faster time solutions and lower cost of designs.
3. In Artificial Intelligence (AI)
Many experts in the miniaturization period predicted that future technology would be smarter. Today we have smart homes, smart surveillance systems, and smart wearable devices. With the rise in Artificial Intelligence, the semiconductor industries are creating diversity in the markets. According to the SEMI industry association, the mixture of 5G cellular communication and AI will result in major growth in the semiconductor market. They predicted that by the start of the year 2022, the total worth of the market would be over $500 billion.
Artificial Intelligence, in the semiconductor industry, improves the functionality of the node design capabilities. This smart technology will boost market growth because of various advanced innovations such as sensors.
Conclusion
Wafer bonding, beam re-crystallization, and solid-phase crystallization are some techniques used to manufacture three-dimensional integrated circuits. Today, 3D IC technologies are solving management issues for massive development. It helps with chip signaling, restricted communications capacity, and memory latency. Furthermore, AI tools and technologies will further boost market growth with advanced tools and technologies.
